Product Filter
Показано 61 - 80 из 125
VT07/12 Series
Vitrified bond blade for high-load processing
The VT07/12 series can handle various materials from processing of difficult-to-cut ...
The VT07/12 series can handle various materials from processing of difficult-to-cut ...
CO 2 Injector
High quality processing through direct link to dicing saw
Workpiece charging significantly reduced
The CO2 Injector lowers the resistivity of purified water by dissolving carbon ...
TM11 Series
Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
ZP07 Series
High grade processing is possible with an electroplated porous structure blade
The ZP07 series realizes high-grade processing of hard ...
The ZP07 series realizes high-grade processing of hard ...
B1A Series
Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...
Metal bond Applications: Electronics components, Optical devices, Various types of ...
Z09 Series
Electroformed blades with higher strength and variety of oncentration
The Z09 series adopts a newly developed high strength bond and meets ...
The Z09 series adopts a newly developed high strength bond and meets ...
R07 Series
Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...
StayClean-A
Prevents particle adhesion during dicing
Cutting water additive to prevent particle adhesion
Particle adhesion is a ...
DCS1460
Manual cleaning system for Φ300 mm wafers with enhanced cleaning performance
The DCS1460 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
DCS1440
Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance
The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
DTU1550
Next generation water temperature control unit which has improved cooling efficiency and water supply capacity
Stable High Precision Processing
DTU1550 is a water supply unit for ...
StayClean Injector
Dedicated unit for injecting StayClean into cutting water
Highly accurate dilution control to ratios as low as 1:10,000.
• Automatic bottle replacement enables continuous ...
DWR1722
Ultracompact DI water recycling unit with extraordinary energy and water conservation
Numerous functions, ultra compact
The DWR1722 is a DI water recycling unit for dicing saws ...
Ultrasonic-wave dicing unit
Realizes high quality and high speed processing of difficult-to-cut materials
Targets for ultrasonic-wave processing
Ultrasonic-wave processing aims to achieve good processing ...
Blade breakage sensor
Processing is stopped immediately if blade breakage occurs to minimize potential workpiece damage.
Non contact setup
Blade tip position relative to the chuck table surface is detected by an optical sensor. Processing quality is stable since the blade wear can be measured at any time during processing.
StayClean-R
Conserving Water While Preventing Corrosion
Prevents Corrosionby DI water
The active component in StayClean-R continuously ...
StayClean-F
Prevents pad corrosion during dicing
Pad corrosion prevention
For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...
Z05 Series
Ultra-high cutting performance for diverse applications.
The Z05 Series offers ultra-high cutting performance for a wide range of ...
The Z05 Series offers ultra-high cutting performance for a wide range of ...
ZHDG Series
Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
Head Office
- Paseo 4B, Paseo de Sta. Rosa, Greenfield City, Sta. Rosa, Laguna Philippines 4026
- +63-(49)-5012436
- +63 908 887 4217
- +63 998 961 9440
- [email protected]
Clark Office
Baguio Office
Cebu Office